The NSN 5962-01-389-7020 part numbers such as 5962-86063, 5962-8606308XA, 5962-8606308XB, 5962-8606308XX, AM27C256-70 manufactured by Dla Land And Maritime, Advanced Micro Devices Inc, Atmel Corporation, Waferscale Integration Inc are available in RFQ Experts’ inventory. An ASAP Semiconductor owned and operated website, RFQ Experts has over six billion parts in its inventory for NSN 5962-01-389-7020. ASAP is committed to streamlining the parts procurement process for our customers, making it easy for them to search through billions of parts to find exactly what they are looking for. We have dedicated account managers ready to solve procurement issues our clients face, whether it’s a need for obsolete parts, or an aircraft on ground situation. As an AS9120B, ISO 9001:2015, and FAA AC 0056B certified company, each and every part that we ship goes through numerous quality checks and inspections, to ensure that we sell only the highest-quality parts.
Alternative NSN: 5962-01-389-7020 |
Item Name: Microcircuit Memory |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013897020 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime, Advanced Micro Devices Inc, Atmel Corporation, Waferscale Integration Inc |
Part No | NSN | Item Name | QTY | RFQ |
---|---|---|---|---|
5962-86063 | 5962-01-389-7020 | microcircuit memory | Avl | RFQ |
5962-8606308XA | 5962-01-389-7020 | microcircuit memory | Avl | RFQ |
5962-8606308XB | 5962-01-389-7020 | microcircuit memory | Avl | RFQ |
5962-8606308XX | 5962-01-389-7020 | microcircuit memory | Avl | RFQ |
AM27C256-70 | 5962-01-389-7020 | microcircuit memory | Avl | RFQ |
AT27HC256R-70DM 883 | 5962-01-389-7020 | microcircuit memory | Avl | RFQ |
ROM PROM HEAD 199 | 5962-01-389-7020 | microcircuit memory | Avl | RFQ |
WS57C256F-70DMB | 5962-01-389-7020 | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 37.85 MILLIMETERS MAXIMUM |
ADAT | BODY WIDTH | 12.70 MILLIMETERS MINIMUM AND 15.49 MILLIMETERS MAXIMUM |
ADAU | BODY HEIGHT | 4.40 MILLIMETERS MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED AND ULTRAVIOLET ERASABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
CTQX | CURRENT RATING PER CHARACTERISTIC | 90.00 MILLIAMPERES MAXIMUM INPUT DRIVE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 14.0 VOLTS NOMINAL TOTAL SUPPLY |
CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS |
CZER | MEMORY DEVICE TYPE | EPROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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