The NSN 5962-01-274-7927 part numbers such as X20C04EMB-25, X2004EMB 25, X2004EM-25 C6317, 8507005-255, 795099-1 manufactured by Xicor Ltd, Honeywell International Inc, Hamilton Sundstrand Corporation, Dla Land And Maritime, Paaesikunta Logistiikkaosasto are available in RFQ Experts’ inventory. An ASAP Semiconductor owned and operated website, RFQ Experts has over six billion parts in its inventory for NSN 5962-01-274-7927. ASAP is committed to streamlining the parts procurement process for our customers, making it easy for them to search through billions of parts to find exactly what they are looking for. We have dedicated account managers ready to solve procurement issues our clients face, whether it’s a need for obsolete parts, or an aircraft on ground situation. As an AS9120B, ISO 9001:2015, and FAA AC 0056B certified company, each and every part that we ship goes through numerous quality checks and inspections, to ensure that we sell only the highest-quality parts.
| Alternative NSN: 5962-01-274-7927 |
| Item Name: Microcircuit Memory |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012747927 |
| NCB Code: USA (01) |
| Manufacturers: Xicor Ltd, Honeywell International Inc, Hamilton Sundstrand Corporation, Dla Land And Maritime, Paaesikunta Logistiikkaosasto |
| Xicor Ltd | Honeywell International Inc | Hamilton Sundstrand Corporatio.. |
| Dla Land And Maritime | Paaesikunta Logistiikkaosasto |
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| X20C04EMB-25 | 5962-01-274-7927 | microcircuit memory | Avl | RFQ |
| X2004EMB 25 | 5962-01-274-7927 | microcircuit memory | Avl | RFQ |
| X2004EM-25 C6317 | 5962-01-274-7927 | microcircuit memory | Avl | RFQ |
| 8507005-255 | 5962-01-274-7927 | microcircuit memory | Avl | RFQ |
| 795099-1 | 5962-01-274-7927 | microcircuit memory | Avl | RFQ |
| 5R8067-042-3002 | 5962-01-274-7927 | microcircuit memory | Avl | RFQ |
| 5962-8771201YA | 5962-01-274-7927 | microcircuit memory | Avl | RFQ |
| 10133817 | 5962-01-274-7927 | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 21 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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