The NSN 5962-01-151-4621 part numbers such as F2114, IM2114LMJN883B, MCM2114, MD2114A-5 B, SMJ2114-45JM manufactured by Fairchild Semiconductor Ltd, Intersil Inc, Freescale Semiconductor Inc, Intel Corporation, Texas Instruments Incorporated are available in RFQ Experts’ inventory. An ASAP Semiconductor owned and operated website, RFQ Experts has over six billion parts in its inventory for NSN 5962-01-151-4621. ASAP is committed to streamlining the parts procurement process for our customers, making it easy for them to search through billions of parts to find exactly what they are looking for. We have dedicated account managers ready to solve procurement issues our clients face, whether it’s a need for obsolete parts, or an aircraft on ground situation. As an AS9120B, ISO 9001:2015, and FAA AC 0056B certified company, each and every part that we ship goes through numerous quality checks and inspections, to ensure that we sell only the highest-quality parts.
Alternative NSN: 5962-01-151-4621 |
Item Name: Microcircuit Memory |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011514621 |
NCB Code: USA (01) |
Manufacturers: Fairchild Semiconductor Ltd, Intersil Inc, Freescale Semiconductor Inc, Intel Corporation, Texas Instruments Incorporated |
Fairchild Semiconductor Ltd | Intersil Inc | Freescale Semiconductor Inc |
Intel Corporation | Texas Instruments Incorporated |
Part No | NSN | Item Name | QTY | RFQ |
---|---|---|---|---|
F2114 | 5962-01-151-4621 | microcircuit memory | Avl | RFQ |
IM2114LMJN883B | 5962-01-151-4621 | microcircuit memory | Avl | RFQ |
MCM2114 | 5962-01-151-4621 | microcircuit memory | Avl | RFQ |
MD2114A-5 B | 5962-01-151-4621 | microcircuit memory | Avl | RFQ |
SMJ2114-45JM | 5962-01-151-4621 | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
CZER | Memory Device Type | ROM |
ADAT | Body Width | 0.220 INCHES MINIMUM AND |
CQZP | Input Circuit Pattern | 12 INPUT |
CBBL | Features Provided | HERMETICALLY SEALED AND |
CQSJ | Inclosure Material | GLASS |
CQSJ | Inclosure Material | CERAMIC AND |
ADAT | Body Width | 0.310 INCHES MAXIMUM |
CWSG | Terminal Surface Treatment | SOLDER |
CBBL | Features Provided | POSITIVE OUTPUTS |
ADAQ | Body Length | 0.960 INCHES MAXIMUM |
MRC | Decoded Requirement | Clear Text Reply |
ADAU | Body Height | 0.140 INCHES MINIMUM AND |
TEST | Test Data Document | 96906-MIL-STD-833 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CTFT | Case Outline Source And Designator | D-6 MIL-M-38510 |
AEHX | Maximum Power Dissipation Rating | 1.000 MILLIWATTS |
AGAV | End Item Identification | TELETYPEWRITER SET,AN/UGC-129(V) |
TTQY | Terminal Type And Quantity | 18 PRINTED CIRCUIT |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
CZEN | Voltage Rating And Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
CQWX | Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
ADAU | Body Height | 0.185 INCHES MAXIMUM |
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