The NSN 5961-00-127-1473 part numbers such as 1N5141A, 1N5141A, 1N5141A, 1N5141A, 1N5141A manufactured by Api Electronics Inc, Codi Inc, Crystalonics Inc, Eastron Corp, Electronic Industries Inc are available in RFQ Experts’ inventory. An ASAP Semiconductor owned and operated website, RFQ Experts has over six billion parts in its inventory for NSN 5961-00-127-1473. ASAP is committed to streamlining the parts procurement process for our customers, making it easy for them to search through billions of parts to find exactly what they are looking for. We have dedicated account managers ready to solve procurement issues our clients face, whether it’s a need for obsolete parts, or an aircraft on ground situation. As an AS9120B, ISO 9001:2015, and FAA AC 0056B certified company, each and every part that we ship goes through numerous quality checks and inspections, to ensure that we sell only the highest-quality parts.
Alternative NSN: 5961-00-127-1473 |
Item Name: Semiconductor Devic |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 001271473 |
NCB Code: USA (00) |
Manufacturers: Api Electronics Inc, Codi Inc, Crystalonics Inc, Eastron Corp, Electronic Industries Inc, Msi Electronics Inc, Silicon Transistor Corp, Telcom Semiconductor Inc, Freescale Semiconductor Inc, Litton Systems Inc |
Part No | NSN | Item Name | QTY | RFQ |
---|---|---|---|---|
1N5141A | 5961-00-127-1473 | semiconductor devic | Avl | RFQ |
1N5141A | 5961-00-127-1473 | semiconductor devic | Avl | RFQ |
1N5141A | 5961-00-127-1473 | semiconductor devic | Avl | RFQ |
1N5141A | 5961-00-127-1473 | semiconductor devic | Avl | RFQ |
1N5141A | 5961-00-127-1473 | semiconductor devic | Avl | RFQ |
1N5141A | 5961-00-127-1473 | semiconductor devic | Avl | RFQ |
1N5141A | 5961-00-127-1473 | semiconductor devic | Avl | RFQ |
1N5141A | 5961-00-127-1473 | semiconductor devic | Avl | RFQ |
1N5141A | 5961-00-127-1473 | semiconductor devic | Avl | RFQ |
217-20-1 | 5961-00-127-1473 | semiconductor devic | Avl | RFQ |
RELEASE5259A | 5961-00-127-1473 | semiconductor devic | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | GLASS |
ABHP | OVERALL LENGTH | 0.230 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
ADAV | OVERALL DIAMETER | 0.085 INCHES MINIMUM AND 0.107 INCHES MAXIMUM |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-7 |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 60.0 MAXIMUM REVERSE BREAKDOWN VOLTAGE, DC |
CTRD | POWER RATING PER CHARACTERISTIC | 400.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
ZZZK | SPECIFICATION/STANDARD DATA | 80131-RELEASE5259 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
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