Part detail
Semiconductor Devic
1N5709BNSN5961-01-380-7536CAGE1HJ31
Semiconductor Devic
Detailed description
1N5709B procurement notes
Semiconductor Devic
Specifications
Reference data
Multi-line procurement
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Compliance
- AS9120:2025· Aerospace QMS
- ISO 9001:2015· Quality Management
- FAA AC 00-56B· Voluntary Industry Distributor Accreditation
- U.S. ONLY· Fulfillment
NSN Information for Part Number 1N5709B with NSN 5961-01-380-7536, 5961013807536
Characteristics Data of NSN 5961-01-380-7536, 5961013807536
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | CERAMIC" |
| ABHP | OVERALL LENGTH | 0.260 INCHES MINIMUM" |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM" |
| ADAV | OVERALL DIAMETER | 0.120 INCHES MINIMUM" |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-7" |
| AXGY | MOUNTING METHOD | TERMINAL" |
| AYQS | TERMINAL CIRCLE DIAMETER | 0.018 INCHES MINIMUM" |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON" |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 65.0 MINIMUM BREAKDOWN VOLTAGE, INSTANTANEOUS" |
| CTRD | POWER RATING PER CHARACTERISTIC | 400.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR MEGAWATTS" |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 78.0 MINIMUM AND 86.0 MAXIMUM" |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR" |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED" |
| TEST | TEST DATA DOCUMENT | 80063-A3132211 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA" |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD" |
| ABBH | INCLOSURE MATERIAL | CERAMIC" |
| ABHP | OVERALL LENGTH | 0.260 INCHES MINIMUM" |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM" |
| ADAV | OVERALL DIAMETER | 0.120 INCHES MINIMUM" |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-7" |
| AXGY | MOUNTING METHOD | TERMINAL" |
| AYQS | TERMINAL CIRCLE DIAMETER | 0.018 INCHES MINIMUM" |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON" |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 65.0 MINIMUM BREAKDOWN VOLTAGE, INSTANTANEOUS" |
| CTRD | POWER RATING PER CHARACTERISTIC | 400.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR MEGAWATTS" |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 78.0 MINIMUM AND 86.0 MAXIMUM" |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR" |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED" |
| TEST | TEST DATA DOCUMENT | 80063-A3132211 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA" |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD" |