The NSN 5961-01-034-8377 part numbers such as 5082-8868, 5082-8868, 925192-501B, A4X528, A4X528 manufactured by Hewlett Packard Inc, Avago Technologies U S Inc, Raytheon Company, Fei Microwave Inc, Frequency Electronics Inc are available in RFQ Experts’ inventory. An ASAP Semiconductor owned and operated website, RFQ Experts has over six billion parts in its inventory for NSN 5961-01-034-8377. ASAP is committed to streamlining the parts procurement process for our customers, making it easy for them to search through billions of parts to find exactly what they are looking for. We have dedicated account managers ready to solve procurement issues our clients face, whether it’s a need for obsolete parts, or an aircraft on ground situation. As an AS9120B, ISO 9001:2015, and FAA AC 0056B certified company, each and every part that we ship goes through numerous quality checks and inspections, to ensure that we sell only the highest-quality parts.
| Alternative NSN: 5961-01-034-8377 |
| Item Name: Semiconductor Devic |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 010348377 |
| NCB Code: USA (01) |
| Manufacturers: Hewlett Packard Inc, Avago Technologies U S Inc, Raytheon Company, Fei Microwave Inc, Frequency Electronics Inc, Macom, Microsemi Corp, Aeroflex Metelics Inc |
| Hewlett Packard Inc | Avago Technologies U S Inc | Raytheon Company |
| Fei Microwave Inc | Frequency Electronics Inc | Macom |
| Microsemi Corp | Aeroflex Metelics Inc |
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 5082-8868 | 5961-01-034-8377 | semiconductor devic | Avl | RFQ |
| 5082-8868 | 5961-01-034-8377 | semiconductor devic | Avl | RFQ |
| 925192-501B | 5961-01-034-8377 | semiconductor devic | Avl | RFQ |
| A4X528 | 5961-01-034-8377 | semiconductor devic | Avl | RFQ |
| A4X528 | 5961-01-034-8377 | semiconductor devic | Avl | RFQ |
| A4X528 | 5961-01-034-8377 | semiconductor devic | Avl | RFQ |
| GC20183-38 | 5961-01-034-8377 | semiconductor devic | Avl | RFQ |
| MX1052-501B | 5961-01-034-8377 | semiconductor devic | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS |
| ABHP | OVERALL LENGTH | 0.085 INCHES MINIMUM AND 0.095 INCHES MAXIMUM |
| ADAV | OVERALL DIAMETER | 0.119 INCHES MINIMUM AND 0.124 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACE GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TEST | TEST DATA DOCUMENT | 82577-925192 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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